切割研磨服務
Back-side Grinding
| Class 1K |
◆ 4”~12” Wafer Back-side Grinding ◆ 8”~12” Wafer Polish Solution ◆ Wafer TTV ≦ 5 μ m ◆ Chip TTV ≦ 2 μ m |
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Sawing
| Class 1K |
◆ 4”~12” Wafer Sawing ◆ Dual Cutting Function ◆ High-pressure & Atomizing Cleaning System(二流體清洗裝置 ) ◆ Dust Collecting System |
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Pick & Place
| Class 100 |
◆ 4”~8” Wafer Pick & Place ◆ Map & Ink Pick & Place Solution ◆ Chip Back-side AOI Inspection System |
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